Substrate cleaning apparatus
US6901938B2 · kind B2 · utility
17Cited by
18References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2003 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Nov 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.