Method and apparatus for electrostatically maintaining substrate flatness
US6902682B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2002 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Nov 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for holding a substrate on a support layer in a processing chamber. The method includes the steps of positioning the substrate a predetermined distance from the support layer, introducing a plasma in the processing chamber, lowering the substrate to a point where the substrate engages the support layer, and maintaining the plasma for a predetermined time. The apparatus is directed to a susceptor system for a processing chamber in which a substrate is electrostatically held essentially flat. The apparatus includes a substrate support and a support layer composed of a dielectric material disposed on the substrate support. At least one lift pin is used for supporting the substrate relative to the support layer. Means are provided for moving each lift pin relative to the support layer. Means are also provided for producing a plasma within the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.