Patent · US Expired

Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device

US6902951B2 · kind B2 · utility

61Cited by

7References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Bernd Goller · Otterfing, DE
Robert-Christian Hagen · Sarching, DE
Christian Stuempfl · Schmidgaden, DE
Stefan Wein · Regensburg, DE
Holger Woerner · Regensburg, DE

Key dates

Filing date	Oct 29, 2003
Grant date	Jun 7, 2005
Priority date	—
Expiry date	Oct 29, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semiconductor chip on a rewiring substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.