Stefan Wein
7Patents
6h-index
8Co-inventors
45Inventor score
Filing activity: Jul 31, 2002 → Jul 24, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6902951B2 | Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device | Electricity | 61 | Expired |
| US7276783B2 | Electronic component with a plastic package and method for production | Electricity | 37 | Expired |
| US6710455B2 | Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component | Electricity | 30 | Expired |
| US6867471B2 | Universal package for an electronic component with a semiconductor chip and method for producing the universal package | Electricity | 19 | Expired |
| US6683374B2 | Electronic component and process for producing the electronic component | Electricity | 15 | Expired |
| US7517722B2 | Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds | Electricity | 10 | Active |
| US6953992B2 | Electronic component with at least one semiconductor chip and method for its manufacture | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.