Method for treating substrates for microelectronics and substrates obtained by said method
US6902988B2 · kind B2 · utility
15Cited by
11References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Dec 19, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for the treatment of substrates (1) for microelectronics or optoelectronics comprising a working layer (6) at least partially composed of an oxidizable material on at least one of their faces, this process comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.