Apparatus for manufacturing integrated circuit device
US6905570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2003 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Jul 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a chamber for containing a fluid, a guide seated in the chamber, and a transfer robot for loading and/or unloading a plurality of wafers to and/or from the guide. The wafers are located on the guide. The guide has a supporting member for supporting a wafer and a stopper member for preventing the wafer from being inclined over a predetermined range. The stopper member is in contact with a wafer edge disposed at a higher position than a wafer edge supported by the supporting member. A wafer guide has a stopper member to prevent adjacent wafers from being inclined and coming in contact with each other. Therefore, it is possible to suppress a poor drying such as water spots (or watermarks) produced when wafers are adhered to each other in a drying process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.