Patent · US Expired

Semiconductor component having a material reinforced contact area

US6906370B1 · kind B1 · utility

3Cited by

9References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Holger Hubner · Baldham, DE
Thomas Rohr · Aschheim, DE

Key dates

Filing date	Oct 10, 2000
Grant date	Jun 14, 2005
Priority date	—
Expiry date	Jun 8, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S257/907
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component having a material-reinforced contact area formed of a metal layer is disclosed. The contact area is jointly formed by a second metal area of a first metal layer and a fourth metal area of a second metal layer which is to be contacted. A thickness of the contact area material is at least twice that of a single metal layer and thereby prevents penetrative etching when a hole is created for contacting the metal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.