Micromechanical component

US6906392B2 · kind B2 · utility

Assignee

• PARAGON AG · DE

Inventors

• Hubert Benzel · Neckartenzlingen, DE
• Heribert Weber · Leverkusen, DE
• Michael Bauer · Nittendorf, DE
• Hans Artmann · Magstadt, DE
• Thorsten Pannek · Stuttgart, DE
• Frank Schaefer · Lörrach, DE
• Christian Krummel · Kirchentellinsfurt, DE

Key dates

• Filing date: Jul 6, 2002
• Grant date: Jun 14, 2005
• Expiry date: Jul 6, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/0115
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical component includes a substrate and a cover layer deposited on the substrate, underneath the cover layer, a region of porous material being provided which mechanically supports and thermally insulates the cover layer. On the cover layer, a heating device is provided to heat the cover layer above the region; and above the region, a detector is provided to measure an electric property of a heated medium provided above the region on the cover layer.