Michael Bauer
94Patents
12h-index
86Co-inventors
83Inventor score
Filing activity: Jul 6, 2002 → Nov 6, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7276785B2 | Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof | Electricity | 65 | Expired |
| US7545047B2 | Semiconductor device with a wiring substrate and method for producing the same | Electricity | 56 | Active |
| US7683460B2 | Module with a shielding and/or heat dissipating element | Electricity | 51 | Active |
| US7420262B2 | Electronic component and semiconductor wafer, and method for producing the same | Electricity | 42 | Expired |
| US7619304B2 | Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof | Electricity | 32 | Active |
| US7749797B2 | Semiconductor device having a sensor chip, and method for producing the same | Electricity | 22 | Expired |
| US7482198B2 | Method for producing through-contacts and a semiconductor component with through-contacts | Electricity | 21 | Active |
| US7464603B2 | Sensor component with a cavity housing and a sensor chip and method for producing the same | Electricity | 19 | Active |
| US8669655B2 | Chip package and a method for manufacturing a chip package | Electricity | 19 | Active |
| US8350382B2 | Semiconductor device including electronic component coupled to a backside of a chip | Electricity | 17 | Active |
| US7009288B2 | Semiconductor component with electromagnetic shielding device | Electricity | 13 | Expired |
| US7230309B2 | Semiconductor component and sensor component for data transmission devices | Electricity | 13 | Expired |
| US8011495B2 | Transfer device metering apparatus and methods | Performing Operations; Transporting | 12 | Active |
| US7462940B2 | Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same | Electricity | 11 | Active |
| US7443019B2 | Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same | Electricity | 8 | Active |
| US6906392B2 | Micromechanical component | Performing Operations; Transporting | 8 | Expired |
| US7656018B2 | Package for an electronic component and method for its production | Electricity | 8 | Active |
| US7554196B2 | Plastic package and semiconductor component comprising such a plastic package, and method for its production | Electricity | 8 | Expired |
| US7705436B2 | Semiconductor device with semiconductor chip and method for producing it | Electricity | 7 | Active |
| US7629660B2 | Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof | Electricity | 7 | Active |
| US7944061B2 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof | Emerging Cross-Sectional Technologies | 7 | Active |
| US7843055B2 | Semiconductor device having an adhesion promoting layer and method for producing it | Emerging Cross-Sectional Technologies | 6 | Active |
| US8574966B2 | Semiconductor device having a semiconductor chip, and method for the production thereof | Electricity | 6 | Active |
| US7795727B2 | Semiconductor module having discrete components and method for producing the same | Electricity | 6 | Active |
| US7935622B2 | Support with solder ball elements and a method for populating substrates with solder balls | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.