Multiple dice package
US6906406B2 · kind B2 · utility
4Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2002 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device for multiple dice is provided that reduces insertion loss and return loss. In an example embodiment, the semiconductor device comprises: a package 20 comprising a mount surface 14 to which dice 61 and 65 are mounted, and a bond pad surface 25 defining at least a first die area 27 and a second die area 29, wherein the second die area 29 is different in form from the first die area 27.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.