Assemblies and packages including die-to-die connections
US6906408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2003 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Mar 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device assembly includes a first semiconductor die, such as a logic device, with bond pads arranged in an array on an active surface thereof, and at least one second semiconductor die, such as a memory device or an ancillary or parallel logic device, with bond pads on an active surface thereof with active surfaces thereof facing each other. Corresponding bond pads of the first and at least one second semiconductor dice are connected to each other by way of conductive structures disposed therebetween. The package includes the assembly and a carrier, such as a carrier substrate or leads. The first semiconductor die is oriented over the carrier such that bond pads thereof that are exposed beyond the periphery of each second semiconductor die face the carrier and are electrically connected to corresponding contacts thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.