Inventor · Boise, ID, US

Eugene H. Cloud

89Patents
33h-index
38Co-inventors
88Inventor score

Filing activity: Jun 20, 1988 → Apr 28, 2009

Most-cited inventions

PatentTitleAreaCited byStatus
US6570248B1 Structure and method for a high-performance electronic packaging assembly Electricity 310 Expired
US6281042A Structure and method for a high performance electronic packaging assembly Electricity 239 Expired
US5990566A High density semiconductor package Electricity 223 Expired
US6756576B1 Imaging system having redundant pixel groupings Electricity 156 Expired
US5110754A Method of making a DRAM capacitor for use as an programmable antifuse for redundancy repair/options on a DRAM Electricity 149 Expired
US7129457B2 Redundant imaging systems Electricity 136 Expired
US6356500B1 Reduced power DRAM device and method Physics 114 Expired
US5324681A Method of making a 3-dimensional programmable antifuse for integrated circuits Electricity 106 Expired
US6249460A Dynamic flash memory cells with ultrathin tunnel oxides Physics 89 Expired
US5155067A Packaging for a semiconductor die Electricity 87 Expired
US6002613A Data communication for memory Physics 85 Expired
US6032264A Apparatus and method implementing repairs on a memory device Physics 83 Expired
US5907512A Mask write enablement for memory devices which permits selective masked enablement of plural segments Physics 83 Expired
US6380581B1 DRAM technology compatible non volatile memory cells with capacitors connected to the gates of the transistors Electricity 77 Expired
US5724288A Data communication for memory Physics 72 Expired
US5910921A Self-test of a memory device Physics 68 Expired
US6456535B2 Dynamic flash memory cells with ultra thin tunnel oxides Physics 65 Expired
US5146308A Semiconductor package utilizing edge connected semiconductor dice Electricity 65 Expired
US6373740B1 Transmission lines for CMOS integrated circuits Electricity 64 Expired
US5714802A High-density electronic module Electricity 64 Expired
US6906408B2 Assemblies and packages including die-to-die connections Electricity 61 Expired
US5653619A Method to form self-aligned gate structures and focus rings Electricity 59 Expired
US6521958B1 MOSFET technology for programmable address decode and correction Electricity 59 Expired
US5815427A Modular memory circuit and method for forming same Electricity 56 Expired
US6525413B1 Die to die connection method and assemblies and packages including dice so connected Electricity 55 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.