Chemical mechanical polishing endpoint detection
US6908374B2 · kind B2 · utility
31Cited by
9References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Aug 24, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical processing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.