High density element structure formed by assembly of layers and method for making same
US6909445B2 · kind B2 · utility
3Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2001 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Feb 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A structure including a sequence of elements for sending or receiving a signal along an axis. Two successive elements along the direction of the axis are offset with respect to each other along the direction perpendicular to the axis. The structure includes at least two layers of material deposited on a reception substrate using the layer transfer technique. The structure particularly relates to any type of structure for which elements must have a high density, such as a print bead, networks of optical components, antenna networks, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.