Substrate holder for retaining a substrate within a processing chamber
US6909588B2 · kind B2 · utility
10Cited by
8References
34Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 10, 2003 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Nov 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer chuck is designed to allow the substrate to thermally deform during charged particle beam lithography. The wafer chuck includes a compliant layer disposed over an chuck body. During lithography processing the wafer is electrostatically held in contact with a flexible compliant layer and the wafer is exposed to the charged particle beam resulting in thermal deformation of the wafer. The compliant layer deforms with the substrate and allows the wafer to deform in a predictable manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.