Component installation, removal, and replacement apparatus and method
US6911624B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Sep 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0212
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for attaching a flip chip configured semiconductor die to a substrate as well as removing the die and replacing it on the substrate with another flip chip-configured semiconductor die by way of an electrically resistive thermal supply circuit that provides heat to soften or melt an electrical connection material of discrete conductive elements connecting the two components, as well as providing heat to release a dielectric underfill material, if present. Methods for designing a thermal supply circuit and are also disclosed. Semiconductor die and substrate configurations incorporating thermal supply circuits as well as thermal supply circuit configurations and design approaches are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.