Method and apparatus for evaluating and adjusting microwave integrated circuit
US6911837B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2004 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Aug 2, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15173
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present method includes steps of: discharging a droplet of fluid containing fine particles with electric characteristics from an inkjet nozzle onto the microwave integrated circuit formed on a substrate; forming a coat of the fine particles having electric characteristics on the substrate; measuring electric characteristics of the microwave integrated circuit using a probe of a circuit evaluation apparatus before and after forming the coat; and adjusting the electric characteristics of the microwave integrated circuit, so that forming the coat at a desired location on the upper surface of the circuit substrate by scanning an aim of the inkjet nozzle against the circuit substrate enables the microwave integrated circuit to meet the specification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.