Detection of defects in patterned substrates
US6914441B2 · kind B2 · utility
7Cited by
45References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Apr 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention is a method of detecting defects in a patterned substrate, including: (a) positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV; (b) operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and (c) comparing the acquired images to a reference to identify defects in the patterned substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.