METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, IN WHICH A HIGH-BREAKDOWN-VOLTAGE MOS TRANSISTOR AND A LOW-BREAKDOWN-VOLTAGE MOS TRANSISTOR ARE FORMED ON AN IDENTICAL SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY
US6916714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Jan 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/811
Abstract
A procedure of manufacturing a semiconductor device according to the present invention first creates a gate electrode on a center portion of a gate oxide film formed on a substrate, forms a silicon oxide film over the whole surface of the substrate including the gate electrode, and etches the whole face of the silicon oxide film, so as to form a side wall of the silicon oxide film on a side face of the gate electrode. The procedure then implants an impurity ion according to a channel of a target MOS transistor, so as to specify a drain area and a source area. In the process of specifying the drain area and the source area, a resist is formed in advance on at least a peripheral portion of the gate oxide film in a high-breakdown-voltage MOS transistor, so as to prevent implantation of the impurity ion in an under-layer region below the peripheral portion of the gate oxide film. This arrangement enables both a high-breakdown-voltage MOS transistor and a low-breakdown-voltage MOS transistor to be efficiently formed on an identical substrate without damaging the characteristics of the respective transistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.