Dual gauge leadframe
US6917097B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2003 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Sep 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2076
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.