Patent · US Expired

Method for testing a plurality of devices disposed on a wafer and connected by a common data line

US6917214B2 · kind B2 · utility

3Cited by

4References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gerrit Farber · Hersbruck, DE
Martin Fritz · Kobenz, AT
Jens Mockel · Isny im Allgäu, DE

Key dates

Filing date	Oct 23, 2002
Grant date	Jul 12, 2005
Priority date	—
Expiry date	Oct 23, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

In a method for testing a plurality of devices, which are arranged on a wafer and connected to a common data line, wherein the devices are connectable to a test unit via the common data line, a connection is separated first between a defective device and the common data line, or an internal connection in the defective device is separated. Subsequently, the remaining devices are tested. Alternatively, instead of the connection between the defective device and the common data line, the connection between a defective device and a common or an individual supply line is separated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.