Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs

US6917525B2 · kind B2 · utility

Assignee

• Nanonexus, Inc. · US

Inventors

• Sammy Mok · Cupertino, US
• Fu Chiung Chong · Saratoga, US
• Frank Swiatowiec · San Jose, US
• Syamal Kumar Lahiri · Ossining, US
• Joseph Haemer · San Jose, US

Key dates

• Filing date: Jun 24, 2002
• Grant date: Jul 12, 2005
• Expiry date: Feb 13, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S439/912
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a compliant carrier structure, such as a decal or screen, which is adhesively attached to the probe chip substrate.