Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
US6926589B2 · kind B2 · utility
0Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2002 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | May 29, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.