System and method for metal residue detection and mapping within a multi-step sequence
US6929531B2 · kind B2 · utility
11Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2002 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Sep 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system and method of measuring a metallic layer on a substrate within a multi-step substrate process includes modifying a metallic layer on the substrate such as forming a metallic layer or removing at least a portion of the metallic layer. At least one sensor is positioned a predetermined distance from the surface of the substrate. The surface of the substrate is mapped to determine a uniformity of the metallic layer on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.