Under bump metallurgy structural design for high reliability bumped packages
US6930032B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2002 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Oct 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for creating an under bump metallization layer (37) is provided. In accordance with the method, a die (33) is provided which has a die pad (35) disposed thereon. A photo-definable polymer (51 or 71) is deposited on the die pad, and an aperture (66) is created in the photo-definable polymer. Finally, an under bump metallization layer (37) is deposited in the aperture. A die package is also provided comprising a die having a die pad (35) disposed thereon, and having an under bump metallization layer (37) disposed on the die pad. The structure has a depression or receptacle (57) therein and has a thickness of at least about 20 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.