RF circuits including transistors having strained material layers
US6933518B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2002 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Nov 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/691
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Circuits for processing radio frequency (“RF”) and microwave signals are fabricated using field effect transistors (“FETs”) that have one or more strained channel layers disposed on one or more planarized substrate layers. FETs having such a configuration exhibit improved values for, for example, transconductance and noise figure. RF circuits such as, for example, voltage controlled oscillators (“VCOs”), low noise amplifiers (“LNAs”), and phase locked loops (“PLLs”) built using these FETs also exhibit enhanced performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.