Micro-channel heat exchangers and spreaders
US6934154B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Jul 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is coupled to a thermal mass having a plurality of open microchannels such that a hermetic seal is formed between the die and the bases of the microchannel walls, thus forming a plurality of closed microchannels. In another set of configurations, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. The microchannel heat exchangers may be employed in a closed loop cooling system includes a pump and a heat rejecter. The microchannels are configured to support two-phase heat transfer using a working fluid such as water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.