Heat treatment device
US6936108B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 9, 2000 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Jan 7, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4412
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film-forming unit of the invention includes: a processing furnace, gas-supplying means that supplies a process gas into the processing furnace, heating means that heats an inside of the processing furnace to a predetermined process-temperature, and a normal-pressure gas-discharging system for discharging gas from the processing furnace at a predetermined discharging-pressure that is near to an atmospheric pressure. A valve is provided in the normal-pressure gas-discharging system, the valve being adjustably caused to open and close, a pressure of the gas through the valve being also adjustable. A pressure sensor detects a discharging-pressure in the normal-pressure gas-discharging system. A controller controls the valve based on the pressure detected by the pressure sensor. According to the feature, a stable control can be achieved without necessity of introducing atmospheric air or introducing any inert gas. In addition, a structure of the gas-discharging system is simplified, and reduction of costs for the whole unit is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.