Interference correction of additives concentration measurements in metal electroplating solutions
US6936157B2 · kind B2 · utility
1Cited by
5References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 9, 2002 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Jan 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method and apparatus for determining concentrations of various organic additives in metal electroplating solutions, by utilizing a mathematical correction model in combination with the conventional PCGA chrono-potentiometric analysis method, to eliminate the interaction between the observed electrochemical behavior of various organic additives, and to achieve accurate concentration determination of such additives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.