Fixture used to prepare semiconductor specimens for film adhesion testing
US6936843B2 · kind B2 · utility
20Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Aug 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure pertains to a method of preparing a test specimen for testing of the bonding strength of a layer of additive material to a crystalline substrate, or testing of the bonding strength of one layer of additive material to a second layer of additive material, where both layers of additive material overlie a crystalline substrate. The method includes both test specimen “cutting” from a large sample of material and preparation of an individual test specimen for four-point adhesion testing. Also described is a fixture which is useful for cutting the individual test specimen from the large sample of material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.