Sensor with at least one micromechanical structure and method for production thereof

US6936902B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Frank Reichenbach · Wannweil, DE
• Stefan Pinter · Reutlingen, DE
• Frank Henning · Reutlingen, DE
• Hans Artmann · Magstadt, DE
• Helmut Baumann · Gomaringen, DE
• Franz Laemer · Stuttgart, DE
• Michael Offenberg · Lörrach, DE
• Georg Bischopink · Neckartenzlingen, DE

Key dates

• Filing date: Dec 14, 2000
• Grant date: Aug 30, 2005
• Expiry date: Jan 8, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0145
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.