Patent · US Expired

Semiconductor component and method for its production

US6936928B2 · kind B2 · utility

82Cited by

10References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Harry Hedler · Germering, DE
Thorsten Meyer · Regensburg, DE

Key dates

Filing date	Sep 23, 2002
Grant date	Aug 30, 2005
Priority date	—
Expiry date	Sep 23, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention proposes a semiconductor component with a semiconductor chip having a first main side with at least one contact pad thereon. A protective layer is applied on the first main side such that a clearance is provided around the contact pad. It is possible for the semiconductor component to be connected to a substrate using flip-chip bonding. Elevations that are connected to contact pads via conductor runs located on the protective layer are provided on the first main side. The elevations may be produced either by printable materials or by repeated electrodepositing of the ends of the conductor tracks lying opposite the contact pads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.