Method and apparatus of sealing wafer backside for full-face electrochemical plating
US6939206B2 · kind B2 · utility
10Cited by
19References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Jul 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.