Polishing apparatus
US6939208B2 · kind B2 · utility
35Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2001 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | May 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.