Method and apparatus for detecting wafer flaw
US6941811B2 · kind B2 · utility
2Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2003 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Sep 29, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2698
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.