Multichip module package and fabrication method
US6943057B1 · kind B1 · utility
62Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2004 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Aug 31, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.