Patent · US Expired

Wafer having alignment marks extending from a first to a second surface of the wafer

US6943429B1 · kind B1 · utility

284Cited by

20References

30Claims

0Family size

Assignee

Amkor Technology, Inc. · US

Inventors

Thomas P. Glenn · Gilbert, US
Roy Dale Hollaway · Chandler, US
Steven Webster · Chandler, US

Key dates

Filing date	Mar 8, 2001
Grant date	Sep 13, 2005
Priority date	—
Expiry date	Sep 9, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A marked wafer includes a front-side surface and a back-side surface. A vertical scribe line and a horizontal scribe line are on the front-side surface of the wafer. A back-side alignment mark is located at an intersection of the vertical scribe line and the horizontal scribe line. The back-side alignment mark extends from the front-side surface to the back-side surface of the wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.