EMI shielding apparatus
US6944025B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2003 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Oct 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electromagnetic shielding structure is provided for a microprocessor or other electronic device that emits electromagnetic radiation. The structure includes a heat sink with an integrally formed depending skirt, and a conductive, compressible polymer is applied to a bottom surface of the skirt. The bottom surface mounts against a socket carried on a circuit board and is electrically coupled to a ground plane of the circuit board. The socket substantially surrounds the microprocessor in at least two dimensions (e.g. length and width). A shielding structure is formed at least partly by the heat sink, the socket and the ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.