High power MCM package
US6946740B2 · kind B2 · utility
33Cited by
9References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2003 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Oct 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module that includes a conductive element to serve as an electrical connector for electrically connecting respective electrical contacts of at least two power semiconductor devices and serving as an output connector. The conductive element improving heat transfer from the power semiconductor devices through the top of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.