Modularized probe head
US6946860B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 8, 2003 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Jan 20, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modularized probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having an active surface and an opposing back surface. The back surface of the silicon substrate is attached on a holder. The silicon substrate has a plurality of peripheral bond pads and contact pads on its active surface. At least a probing chip is mounted on the active surface of the silicon substrate. The probing chip has probing tips and side electrodes. The side electrodes are connected with the contact pads by means of solder material. The peripheral bonding pads of the silicon substrate are connected with a flexible printed circuit for electrically connecting to a multi-layer printed circuit board of a probe card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.