Methods for making reinforced wafer polishing pads and apparatuses implementing the same
US6949020B2 · kind B2 · utility
8Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2003 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | May 13, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer where the reinforcement layer is a fibrous-type material. In addition, the polishing pad is located over the base belt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.