Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same
US6951042B1 · kind B1 · utility
35Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2003 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | May 15, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/12
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A substrate cleaning apparatus is provided. The apparatus includes a transducer capable of resonating at a high frequency and a brush material attached to a surface of the transducer. The brush material includes at least one passage extending to the surface of the transducer and is configured to be applied to a surface of a substrate. When the transducer resonates at the high frequency, the transducer is capable of imparting acoustic energy to the surface of the substrate at a location of the at least one passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.