Fritz Redeker
73Patents
11h-index
54Co-inventors
77Inventor score
Filing activity: Jan 21, 1997 → Aug 22, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5882424A | Plasma cleaning of a CVD or etch reactor using a low or mixed frequency excitation field | Electricity | 268 | Expired |
| US6299741A | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus | Electricity | 72 | Expired |
| US6951042B1 | Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same | Performing Operations; Transporting | 35 | Expired |
| US7234477B2 | Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces | Emerging Cross-Sectional Technologies | 35 | Expired |
| US6261157A | Selective damascene chemical mechanical polishing | Electricity | 26 | Expired |
| US6322427A | Conditioning fixed abrasive articles | Performing Operations; Transporting | 25 | Expired |
| US6451697B1 | Method for abrasive-free metal CMP in passivation domain | Chemistry; Metallurgy | 21 | Expired |
| US7615480B2 | Methods of post-contact back end of the line through-hole via integration | Electricity | 20 | Active |
| US7383843B2 | Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7829152B2 | Electroless plating method and apparatus | Electricity | 16 | Active |
| US8241701B2 | Processes and systems for engineering a barrier surface for copper deposition | Electricity | 11 | Active |
| US8287647B2 | Apparatus and method for atomic layer deposition | Electricity | 9 | Active |
| US8771804B2 | Processes and systems for engineering a copper surface for selective metal deposition | Electricity | 8 | Active |
| US8747960B2 | Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide | Emerging Cross-Sectional Technologies | 7 | Active |
| US7799141B2 | Method and system for using a two-phases substrate cleaning compound | Electricity | 7 | Active |
| US8622020B2 | Simultaneous electroless plating of two substrates | Electricity | 7 | Active |
| US8916232B2 | Method for barrier interface preparation of copper interconnect | Electricity | 7 | Active |
| US7521358B2 | Process integration scheme to lower overall dielectric constant in BEoL interconnect structures | Electricity | 6 | Active |
| US8475599B2 | Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions | Electricity | 6 | Active |
| US7810513B1 | Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same | Emerging Cross-Sectional Technologies | 5 | Active |
| US8026605B2 | Interconnect structure and method of manufacturing a damascene structure | Electricity | 5 | Active |
| US7615486B2 | Apparatus and method for integrated surface treatment and deposition for copper interconnect | Electricity | 4 | Active |
| US8480810B2 | Method and apparatus for particle removal | Electricity | 4 | Active |
| US7032269B2 | Brush scrubbing-high frequency resonating substrate processing system | Performing Operations; Transporting | 3 | Expired |
| US8133812B2 | Methods and systems for barrier layer surface passivation | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.