Method and apparatus of arrayed sensors for metrological control
US6951624B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2004 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Jun 29, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/44
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A sensor array external to the CMP tool is included. The sensor array is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The sensor array provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.