Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
US6952041B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2003 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Oct 8, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0307
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.