Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US6953515B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2003 |
| Grant date | Oct 11, 2005 |
| Priority date | — |
| Expiry date | Jun 11, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for providing a substantially constant environment in the cavity surrounding the optical pathway during the chemical mechanical planarization (CMP) operation is provided. In one embodiment, a system for planarizing the surface of a substrate is provided. The system includes a platen configured to rotate about its center axis. The platen supports an optical view-port assembly for assisting in determining a thickness of a layer of the substrate. A polishing pad disposed over the platen is included. The polishing pad has an aperture overlying a window of the optical view-port assembly. A carrier for holding the substrate over the polishing pad is also included. A cavity defined between the surface of the substrate and the window is included. A fluid delivery system adapted to provide a stable environment in the cavity during a chemical mechanical planarization (CMP) operation is included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.