CMP composition and process
US6955586B2 · kind B2 · utility
0Cited by
5References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 3, 2003 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Nov 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a chemical metal polishing (CMP) method with improved flexibility and improved processing window, especially as it relates to the chemical aspect of CMP technology. Broadly speaking, the invention has two aspects: according to one aspect, the invention provides a new CMP composition, comprising as an oxidizer, at least one of inorganic halogen derivative and dissolved oxygen while in a second aspect the invention provides an improved method for polishing metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.