Polishing pad conditioning system
US6958005B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2004 |
| Grant date | Oct 25, 2005 |
| Priority date | — |
| Expiry date | Mar 30, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad conditioning system for conditioning a polishing pad in conjunction with a workpiece polishing operation includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a plurality of abrasive particles protruding from a surface of the pad conditioning head. The positioning unit is configured to move the surface into contact with a polishing pad. The pad conditioning system also includes a liquid supply nozzle. The liquid supply nozzle is configured to selectively discharge liquid proximate to the abrasive particles that are in contact with the polishing pad to minimize frictional wear of the abrasive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.