Patent · US Expired

Process for the back-surface grinding of wafers

US6958256B2 · kind B2 · utility

8Cited by

13References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Rogalli · Rottenburg am Neckar, DE
Manfred Schneegans · Vaterstetten, DE

Key dates

Filing date	Oct 30, 2003
Grant date	Oct 25, 2005
Priority date	—
Expiry date	Dec 25, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68327
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The present invention relates to a process for the back-surface grinding of wafers using films which have a support layer, which is known per se, and an adhesion layer which can be polymerized in steps, and to films which include such an adhesion layer which can be polymerized in steps, and to the use thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.