Semiconductor device package
US6960493B2 · kind B2 · utility
25Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2004 |
| Grant date | Nov 1, 2005 |
| Priority date | — |
| Expiry date | Aug 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.